CMI760测厚仪
CMI760测厚仪
CMI760测厚仪产品描述：
The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.
The CMI760 and CMI760N packages measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry. The package consists of a CPU unit, a probe and NIST traceable calibration standards. The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring user-replaceable measurement tips for the standard (CMI760, SRP-4) or narrow (CMI760N, SRP-4N) varieties.
*您的姓名：
*联系手机：
固话电话：
E-mail:
所在单位：
需求数量：
*咨询内容:
898995850
