The MHT-800D precision laser Stand-Off Height “D” Measuring Station
is specially designed to measure the height of the component after lead
forming , that is the height difference between the bottom of the component
body and the bottom side of the pin.
芯片站高测量必要性:
SMT芯片高可靠焊接工艺对芯片站高有较高的设计标准，芯片在入库及出库装配
前需要检测确认站高数据，以确保对应贴片参数的一致性、准确性。
MHT-800D芯片站高精密激光测量仪专业设计用于测量芯片成型后站高“D”，
即芯片本体底部与引脚焊接面底部的高度差。成型过程中由于芯片引脚材料、
厚度、回弹系数等参数的不一致性，需要反复检测验证成型后实际芯片站高"D"，
对应调整成型模具站高参数，以最终达到设计站高要求。
Lead Egress Point “H”: Dimension measured from the bottom
of the unformed lead exiting the body to the bottom of the
component body.
芯片引线下本体厚度测量必要性：
带引线框芯片在成型前首先需精确测量引线下本体厚度"H"，以精确设定成型
模具站高参数。
MHT-800D芯片站高精密激光测量仪可同时用于测量芯片成型前引线下本体厚
度“H”，即成型前引线底部与芯片本体底部的高度差。非接触式激光测距有效解决
卡尺方式测试不易基准点定位的难题。
Using 655nm wave length laser precision ranging technology,
with external large touch screen display and control. Easy operation ,
built-in high-precision laser displacement sensor, real-time measuring
and display Stand-Off Height , list of measurement data record .
采用655nm 波长激光非接触式精密测距技术，内置式高精度激光位移传感器，测距
精度可达0.005mm，外接分体式大屏幕显示和触摸控制，操作简便、快捷，实时准确
测量芯片引线下本体厚度"H"和站高"D"，并显示、记录测量数据。
The overall sheet metal structure and anti-static paint, with
anti-static ground device for ESD safety.
测量仪整体钣金结构及防静电漆喷涂，配置防静电接地装置，确保芯片静
电防护安全。
The measuring table using 10mm stainless steel reference plate and
standard 4.00mm calibration block to verify the accuracy of the
measurement results.
测量平台采用10mm不锈钢基准板，配置标准4.00mm校正模
块，实时校验测量参数，确保测量结果准确
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