ASC SPI7500 锡膏测厚仪厂家供货商 图片 参数
ASC  7500  3D锡膏测厚仪_锡膏测厚仪  SPI-7500一键测量3D
    
ASC  7500  3D锡膏测厚仪描述
ASC  SPI-7500锡膏测厚仪
一、    产品功能
1、快速编程，友善的编程界面      
2、多种方式测量                                                                                                                        
3、真正一键式测量  
4、八方运动按钮，一键聚焦    
5、    扫描间距可调  
6、  锡膏3D模拟功能      
7、  强大的SPC功能              
8、MARK偏差自动修正                                                                                                                                                                                                                                                                                              
9、一键回屏幕中心功能                                                                                                                                                                                                                                                                                                              
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                  
      二、产品特色      
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                    
  自  动  识  别  目  标

本全自动3D锡膏厚度测试仪能通过自动XY平台的移动/Z轴图像自动聚焦及激光的扫描锡膏获得每个点的3D数据,也可用来量测整个焊盘锡膏的平均厚度,使锡膏印刷过程良好受控。
  [特点]
1、    可编程测量若干个区域，在不同测试点自动聚焦，克服板变形造成的误差；
2、    通过PCB  MARK自动寻找检查位置并矫正偏移；
3、    测量方式：全自动，自动移动手动测量，手动移动手动测量；                                                                                                                                                                                                                  
4、    锡膏3D模拟图，再现锡膏真实形貌；
5、  采用3轴自动移动、对焦，自动补偿修正基板翘曲变形，获取准确锡膏高度；
6、  高速高分辨率相机，精度高，强大SPC数据统计分析；
7、  SIGMA自动判异功能,使您的操作员具备实时判别锡膏印刷过程品质的能力;
8、  自动生成CP、CPK、X-BAR、R-CHART、SIGMA柱形图、趋势图、管制图等；                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                          
9、  2D辅助测量，两点间距离，面积大小等；
10、  测量结果数据列表自动保存，生成SPC报表
  
              
可实时切换3种不同的3D动态显示模式，可放大缩小和旋转
                                          
三、产品参数

  1、  应用范围：锡膏.红胶.BGA.FPC.CSP
  2、  测量项目：厚度.面积.体积.3D形状.平面距离
  3  、测量原理：激光3角函数法测量
  4、软体语言：中文/英文
  5、  照明光源：白色高亮LED
  6、  测量光源：红色激光模组
  7、  X/Y移动范围：标准350mm*340mm(较大移动尺寸可特殊定制)
  8、  测量方式：自动全屏测量.框选自动测量.框选手动测量
  9、  视野范围：5mm*7mm
10、  相机像素：300万/视场
11、  最高分辨率：0.1um
12、  扫描间距：4  um  /8  um  /10  um  /12  um
13、  重复测量精度：高度小于1um，面积<1%,体积<1%
14、  放大倍数：50X
15、  最大可测量高度：5  mm
16、  最高测量速度：250Profiles/s
17、  3D模式：渲染.面.线.点3种不同的3D模拟图,可缩放.旋转
18、  SPC软件：产线资料,印刷资料，锡膏资料，钢网资料，测量结果分别独立分析，X-Bar&R图分析，直方图分析&Ca/Cp/Cpk输出，Sigma自动判断
19、  操作系统：WINOOWs7
20、  计算机系统：双核P4，2G内存，20寸LCD
21、  电源：220V  50/60Hz
22、  最大消耗功率：500W
23、  重量：约85KG
24、  外形尺寸：L*W*H(700  mm  *800  mm  *400  mm)