|
Cu |
Ni |
Zn |
Si |
Sn |
Other |
|
Balance |
1.4%-1.7% |
0.02%-0.7% |
0.2%-0.35% |
0.02%-0.3% |
0.5% max |
|
Density |
proportion |
g/cm3 |
8.9 |
|
Electrical Conductivity |
Conductivity[note -] |
%IACS |
50 |
|
Thermal Conductivity |
heat conductionsystemnumber |
W/(m. K) |
260 |
|
Coefficient of Thermal Expansion |
thermal expansionsystemnumber |
10 -6/K |
16.8 |
|
Modulus of Elasticity |
elasticsystemnumber |
GPa (kN/mm2) |
135 |
|
Stress Relaxation(Remaining Stress) Rate 150°C X 1000h |
Stress relaxation rate |
% |
80 |
The above values are average reference values for reference only
Note 1: this value is the lowestTemperAs benchmark
|
Temper |
Tensile Strength MPa (N/mm2) |
Yield Strength MPa (N/mm2) |
Elongation % |
Hardness HV |
Bendability 90°Bend |
|
|
state |
Tensile strength |
proof stress |
elongation |
hardness |
thickness≤0.5mm |
|
|
G/W |
B/W |
|||||
|
R360 |
360-430 |
≧300 |
≧12 |
100-130 |
0 |
0 |
|
R410 |
410-470 |
≧360 |
≧9 |
125-155 |
0 |
0.5 |
|
R460 |
460-520 |
≧410 |
≧7 |
135-165 |
0.5 |
1 |
|
R520 |
520-580 |
≧460 |
≧5 |
145-175 |
1 |
2 |
|
R530 |
530-630 |
≧430 |
≧14 |
150-190 |
0 |
0 |
|
R580 |
580-660 |
≧540 |
≧8 |
170-200 |
1 |
1 |
|
R580S |
580-660 |
≧520 |
≧9 |
170-200 |
0.5 |
0.5 |
|
R620 |
620-700 |
≧560 |
≧7 |
180-210 |
1 |
1.5 |
898995850
